At present, polycrystalline silicon photovoltaic cells play a dominant role in silicon-based solar cells because of its advantages such as relatively simple preparation process and …
In order to reduce production costs and improve the production efficiency, the solar photovoltaics cell substrates silicon wafers are developing in the direction of large size and ultra-thin, and the diamond wire slicing technology is developing in the direction of high wire speed and fine wire diameter.
ABSTRACT: This work discusses challenges and advantages of cut solar cells, as used for shingling and half-cell photovoltaic modules. Cut cells have generally lower current output and allow reduced ohmic losses at the module level.
Cutting silicon solar cells from their host wafer into smaller cells reduces the output current per cut cell and therefore allows for reduced ohmic losses in series interconnection at module level. This comes with a trade-off of unpassivated cutting edges, which result in power losses.
Silicon-based solar photovoltaics cells are an important way to utilize solar energy. Diamond wire slicing technology is the main method for producing solar photovoltaics cell substrates.
In addition, the change in microcrack morphology caused by higher wire speed and feed speed, the risk of silicon wafer fracture was further increased. In short, the rapid development of the solar-PV industry has made the problem of silicon wafer fracture increasingly prominent.
Therefore, innovating and upgrading slicing technology, reducing production costs and increasing efficiency have always been the main theme of the PV industry. At present, to reduce the production cost of solar-PV substrate, the trend of “large size”, “thinned” and “fine wire diameter” is clear.